H1117S-3.3J

MICROELECTRONICS CORP.

Spec. No. : Preliminary DataIssued Date : 1998.06.01Revised Date : 2000.10.01Page No. : 1/6

H1117J Series

1A LOW DROPOUT POSITIVE VOLTAGE REGULATOR

Features

• Low Dropout Voltage 1.2V at 1A• Adjustable or Fixed Voltage

• Maximum Line Regulation 0.45%• Maximum Load Regulation 0.4%• Adjust Pin Current Less Than 90 uA• Over Current Protection• Thermal Protection

Applications

• High Efficiency Linear Regulators• 5V to 3.3V Voltage Converter• Battery Charger

General Description

The H1117J is a 1A low-dropout positive voltage regulator. It is available in fixed and adjustable output voltageversions. Over current and thermal protection are integrated onto the chip. Output current will decrease while itreaches the pre-set current or temperature limit. The dropout voltage is specified at 1.2V Maximum at full ratedoutput current. H1117J Series provides excellent regulation over variations due to changes in line, load andtemperature. H1117J is three terminal regulator and available in popular packages.

Device Selection Guide

DeviceH1117J(Adj)H1117-3.3J

Output Voltage1.3V to 4V

3.3

PackageD-PAKTO-252

Absolute Maximum Ratings

ParameterInput VoltagePower DissipationThermal Resistance Junction To Case TO-252Thermal Resistance Junction To Ambient TO-252Operating Junction Temperature RangeStorage Temperature RangeLead Temperature (Soldering) 10 SecSymbolVINPDθJCθJATjTSTGTLEADMaximum20Internally Limited151560 To 125-65 To 150260UnitsVW°C/W°C/W°C°C°CTypical ApplicationH1117J+4.75Vto 20VDC10uFTANGND10uFTANLoadInput Range Depends On VOPlease Refer To Electrical Characteristics.HSMC Product SpecificationHI-SINCERITY

MICROELECTRONICS CORP.

Block DiagramInputSpec. No. : Preliminary DataIssued Date : 1998.06.01Revised Date : 2000.10.01Page No. : 2/6

CurrentLimitingAmplifierThermalProtectionErrorAMPOutputBandcapReferenceADJ/COMElectrical CharacteristicsH1117J (adj version)ParameterReference VoltageLine RegulationLoad RegulationDropout VoltageCurrent LimitTemperature Coeff.Adjust Pin CurrentAdjust Pin Current ChangeTemperature StabilityMinimum Load CurrentRMS Output NoiseRipple Rejection RatioSymbolVREFRegLINERegLOADVDISTCIadj∆IadjTSIOVNRASymbolVORegLINERegLOADVDISIQTCTSVNRATest ConditionsVIN=5V, IO=10mA, Tj=25°CVIN=5V, IO=10mA, Over Temp.VIN=4.75~20V, IO=10mA, Tj=25°CVIN=4.75~20V, IO=10mA, Over Temp.VIN=5V, IO=10mA~1A,Tj=25°CVIN=5V, IO=10mA~1A, Over Temp.IO=10mA~1A, Over Temp., ∆VO=±1%VIN=2.75~7V, Over Temp.VIN=2.75~7V, IO=10mA~1AVIN=2.75~7V, IO=10mA~1A,Tj=25°CVIN=2.75~7V, IO=10mA~1A, Over Temp.VIN=2.75~7V, IO=10mA~1A, Over Temp.VIN=5V, IO=100mA, Over Temp.VIN=5VTj=25°CVIN=5V, IO=1A, Over Temp.Test ConditionsVIN=5V, IO=0A,Tj=25°CVIN=5V, IO=0A, Over Temp.VIN=4.75~20V, IO=0A, Tj=25°CVIN=4.75~20V, IO=0A, Over Temp.VIN=5V, IO=0A~1A,Tj=25°CVIN=5V, IO=0A~1A, Over Temp.IO=0A~1A, Over Temp., ∆VO=±1%VIN=4.75~7V, Over Temp.VIN=5V, IO=0A~1A,Over Temp.VIN=4.75~7V, IO=0A~1AVIN=5V, IO=100mA, Over Temp.Tj=25°CVIN=5V, IO=1A, Over Temp.Min1.2381.225-----1-------60Min3.2703.234-----1----60Typ1.251.25--0.050.21-0.00555-0.20.550.00372Typ3.33.3--0.050.21-120.0050.50.00372Max1.2621.2750.30.450.30.41.2---905-10--Max3.3333.3660.30.450.30.41.2-13----UnitsV%%VA%/°CuA%mA%dBUnitsV%%VAmA%/°C%%dBH1117-3.3JParameterOutput VoltageLine RegulationLoad RegulationDropout VoltageCurrent LimitQuiescent CurrentTemperature Coeff.Temperature StabilityRMS Output NoiseRipple Rejection RatioHSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Characteristics Curve

Load Regulation01.2521.25Spec. No. : Preliminary DataIssued Date : 1998.06.01Revised Date : 2000.10.01Page No. : 3/6

Temperature StabilityOutput Voltage deviation (%)-0.05-0.1Reference Voltage (V)-50-40-30-20-1001020304050607080901001.2481.2461.2441.2421.24-0.15-0.2-0.251.238-50-250255075100125Temperature (ºC)Temperature (ºC)Minimum Operating Current3.53454035Ajust Pin CurrentMinimum Operating Current (mA)2.5Adjust Pin Current (uA)00.111.11.223510152025303521.510.50-0.5302520151050-50-250255075100125Input /Output Differential (V)Temperature (ºC)Short Circuit Current1.6Dropout Voltage1.4Minmum Input/Output Differential (V)1.210.80.60.40.201.4Short Circuit Current (A)1.210.80.60.40.201.21.31.51.72510150.10.3Input/Output Differential (V)0.50.7Output Current (A)0.91HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Applications Description

• Output Voltage Adjustment Like most regulators, the H1117J regulates the output bycomparing the output voltage to an internally generatedreference voltage. On the adjustable version, the VREF isavailable externally as 1.25V between VOUT and ADJ. Thevoltage ratio formed by R1 and R2 should be set to conduct10mA (minimum output load). The output voltage is givenby the following equation : VOUT =VREF (1+R2/R1) + IADJ R2On fixed versions of H1117J, the voltage divider isprovided internally.VINInADJSpec. No. : Preliminary DataIssued Date : 1998.06.01Revised Date : 2000.10.01Page No. : 4/6

OutVREFIADJ10uAR1VOUTR2• Thermal Protection H1117J has thermal protection which limits junctionVOUT =VREF (1+R2/R1) + IADJ R2temperature to 150°C. However, device functionality isonly guaranteed to a maximum junction temperature of+125°C.The power dissipation and junction temperature for H1117J in TO-252 package given byPD=(VIN - VOUT) IOUT, TJUNCTION=TAMBIENT+(PDxθJA), Note : TJUNCTION must not exceed 125°C• Current Limit ProtectionH1117J is protected against overload conditions. Current protection is triggered at typically 1.5A.• Stability And Load Regulation H1117J requires a capacitor from VOUT to GND to provideRPcompensation feedback to the internal gain stage. This isParasiticto ensure stability at the output terminal. Typically, a 10uFLine ResistanceInOuttantalum or 50uF aluminum electrolytic is sufficient.AdjVINNote : It is important that the ESR for this capacitor doesR1not exceed 0.5Ω.ConnectRLR1 to Case The output capacitor does not have a theoretical upperlimit and increasing its value will increase stability. COUT =R2100 uF or more is typical for high current regulator design. H1117J load regulation is limited by the resistance of thewire connecting it to the load(RP). For the adjustableConnectversion, the best load regulation is accomplished when theR2 to Loadtop of the resistor divider(R1) is connected directly to theoutput pin of the H1117J. When so connected, RP is notmultiplied by the divider ratio. For fixed output versions,the top of R1 is internally connected to the output and ground pin can be connected to low side of the load as anegative side sense if, so desired.• Thermal Consideration The H1117J series contain thermal limiting circuitry designed to protect itself for over-temperature conditions.Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As mention inthermal protection section, we need to consider all sources of thermal resistance between junction and ambient.It contains junction-to-case, case-to-heat-sink interface and heat sink resistance itself. An additional heat sink isapplied externally sometimes. It can increase the maximum power dissipation. For example, the equivalentjunction temperature of 300mA output current is 115°C without external heat sink. Under the same junctiontemperature IC can operates 500mA with an adequate heat sink. Therefore, to attach an extra heat sink isrecommended. Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below thedie. The bonding wires are appending paths. The former is the lowest resistance path. Proper mounting isrequired to ensure the best possible thermal flow this area of the package to the heat sink. Thermal compound atthe case-to-heat-sink interface is strongly recommended. The case of all devices in this series is electricallyconnected to the output. Therefore, if the case of the device must be electrically isolated, a thermally conductivespacer can be used, as long its thermal resistance is considered.HSMC Product SpecificationHI-SINCERITY

MICROELECTRONICS CORP.

• Protection Diode

Spec. No. : Preliminary DataIssued Date : 1998.06.01Revised Date : 2000.10.01Page No. : 5/6

(The figure is shown as Regulator with Reverse Diode Protection in advanced applications)

In general operation, H1117J does not need any protection diodes. From the cross-section structure of H1117J,the output pin is connected to P+ substrate, and the input pin is connected to N- well. There is a parasitic reversediode between them. It can handle microsecond surge currents of 5A to 10A. Even with large output capacitance,it is very difficult to get those values of surge currents in normal operation. Only with high value output capacitors,such as 1000uF. And with the input pin instantaneously shorted to ground. can damage occur. A crowbar circuitat the input of the H1117J can generate those kinds of currents, and a diode from output to input is

recommended. Normal power supply cycling or even plugging and unplugging in the system will not generatecurrents large enough to do any damage.

HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

TO-252 DimensionACSpec. No. : Preliminary DataIssued Date : 1998.06.01Revised Date : 2000.10.01Page No. : 6/6

Marking :HSMC LogoPart NumberDate CodeProduct SeriesRankBDLFGInk MarkStyle : Pin 1.COM/ADJ 2.Vout 3.Vin3HEK2I1J3-Lead TO-252 Plastic Surface Mount PackageHSMC Package Code : J*:Typical

DIMABCDEF

InchesMin.Max.0.01770.02170.06500.07680.03540.05910.01770.02360.25200.26770.21250.2283MillimetersMin.Max.0.450.551.651.950.901.500.450.606.406.805.405.80

DIMG

HIJKL

InchesMin.Max.0.08660.1102-*0.0906-0.0354

-0.0315

0.20470.21650.05510.0630MillimetersMin.Max.2.202.80-*2.30

-0.90

-0.80

5.205.501.401.60

Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996.

2.Controlling dimension : millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory :

• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454

• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.CTel : 886-3-5983621~5 Fax : 886-3-5982931

• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.CTel : 886-3-5977061 Fax : 886-3-5979220

HSMC Product Specification